EP101
from Master Bond, Inc.

Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300 °F range. Shrinkage upon cure is... [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Epoxy; 100% Solids
  • Material Type: Thermally cured; CastingResin
  • Filler: Unfilled
FEP -- 3M™ Dyneon™ FEP 6301
from 3M Advanced Materials Division

3M ™ FEP (a polymer of tetrafluoro-ethylene and hexafluoropropylene) offers excellent chemical inertness, heat and weather resistance, exceptional electrical properties, toughness and durability. FEP is used by a variety of industries including telecommunications, wire and cable, semiconductor... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Stress Crack Resistant Tube
  • Chemical System: Fluoropolymer; Tetrafluoroethylene, Hexafluoropropylene
  • Material Type: Thermoplastic; ExtrusionGrade; MoldingCompound
  • Filler: Unfilled
CR-39® Monomer -- H-911
from Homalite

Low-reflectance surface finish available, chemical, abrasion resistant [See More]

  • Industry: Electronics; Optoelectronics or Photonics; OEM or Industrial; Electronic Display Windows
  • Chemical System: CR-39® Monomer
  • Material Type: Thermally cured; Optical
  • Filler: Unfilled
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Material Type: Thermoplastic
  • Form / Shape: Liquid
AvaSpire® Modified PAEK -- AV-621 CF30
from Solvay Advanced Polymers

AvaSpire AV-621 CF30 is a 30% carbon fiber reinforced version of AvaSpire AV-621. It offers better dimensional stability and warp resistance than 30% carbon fiber reinforced PEEK. The AV-621 CF30 grade offers the highest strength, stiffness, and fatigue resistance of any AV-621 based grade. [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial
  • Chemical System: PEEK; Modified PEEK
  • Material Type: Thermoplastic; MoldingCompound
  • Filler: Carbon or Graphite