Electronics Specialty Polymers and Resins Datasheets

Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
  • Chemical System: Epoxy; Cycloaliphatic, 100% Solids
  • Material Type: Thermally cured; CastingResin; Optical
  • Filler: Unfilled
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
  • Chemical System: Polypropylene; Polyamide; Fluoropolymer; Tertrafluoroethylene, Hexafluoropropylene
  • Material Type: Elastomer; Thermoplastic; Thermally cured; ExtrusionGrade; FilmGrade; MoldingCompound; Optical
  • Filler: Unfilled
CR-39® Monomer -- H-911
from Homalite

Low-reflectance surface finish available, chemical, abrasion resistant [See More]

  • Industry: Electronics; Optoelectronics or Photonics; OEM or Industrial; Electronic Display Windows
  • Chemical System: CR-39® Monomer
  • Material Type: Thermally cured; Optical
  • Filler: Unfilled
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Material Type: Thermoplastic
  • Form / Shape: Liquid
TORELINA® Polyphenylene Sulfide (PPS) Resin
from Toray Industries (America), Inc.

Toray's high-performance engineering plastic TORELINA ® resin boasts excellent heat resistance, flame retardancy and chemical resistance, physical strength, and its superb fluidity leads to outstanding dimensional precision. These characteristics make it ideal for a wide range of applications:... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Polyphenyline Sulfide
  • Material Type: Thermoplastic; MoldingCompound
  • Features: Flame Retardant