FEP -- 3M™ Dyneon™ FEP 6301
from 3M Advanced Materials Division

3M ™ FEP (a polymer of tetrafluoro-ethylene and hexafluoropropylene) offers excellent chemical inertness, heat and weather resistance, exceptional electrical properties, toughness and durability. FEP is used by a variety of industries including telecommunications, wire and cable, semiconductor... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Stress Crack Resistant Tube
  • Chemical System: Fluoropolymer; Tetrafluoroethylene, Hexafluoropropylene
  • Material Type: Thermoplastic; ExtrusionGrade; MoldingCompound
  • Filler: Unfilled
3M™ Organic Electronics -- L-20856
from 3M Electronics Design & Manufacturing

3M ™ Organic Electronics provides new materials to build next generation electronics and photonics devices. With a focus on organic semiconductors and dielectrics, these materials will enable the creation of products for: Organic Thin Film Transistors (TFT) – notably for radio frequency... [See More]

  • Industry: Semiconductors or IC Packaging
  • Chemical System: Bis[(triisopropylsilyl)ethynyl]pentacene
  • Material Type: Thermoplastic
  • Filler: Aramid
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Material Type: Thermoplastic
  • Form / Shape: Liquid
AvaSpire® Modified PAEK -- AV-621 GF30 BG20
from Solvay Advanced Polymers

AvaSpire AV-621 GF30 is a 30% glass fiber reinforced version of AvaSpire AV-621. This formulation offers better dimensional stability and lower warpage than 30% glass reinforced PEEK. This resin retains most of the desirable ultra-performance attributes of glass reinforced PEEK, including chemical... [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical Processing, Oil And Gas
  • Chemical System: PEEK; Modified PEEK
  • Material Type: Thermoplastic; MoldingCompound
  • Form / Shape: Pellets
Isolast® Fab Range™ -- J9610
from Trelleborg Sealing Solutions

Hardness of 75 ± 5 Shore A, black, long term low compression set [See More]

  • Industry: Semiconductors or IC Packaging
  • Chemical System: Perfluoroelastomer
  • Material Type: Elastomer
  • Filler: Unfilled