from Master Bond, Inc.
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]
- Features: Anti-static or ESD Control; Electrically Conductive Compound; EMI / RFI Shielding Material
- Chemical System: Epoxy
- Material Type: Thermally cured; CastingResin
- Form / Shape: Liquid
from SABIC
Faradex* compounds provide electromagnetic and radio frequency interference (EMI/RFI) attenuation in applications from electronics to material handling. Conductive fibers form the conductive network required for EMI/RFI shielding. Faradex compounds can also be used in applications where... [See More]
- Features: Anti-static or ESD Control; EMI / RFI Shielding Material
- Chemical System: Polybutylene Terephalate
- Material Type: Thermoplastic; MoldingCompound
- Filler: Metal or MIM
from Bayer MaterialScience LLC
Anionic/non-ionic polyether polyurethane resin dispersed in water. Commonly used as the filmforming component in glass fiber sizing, and is useful for the sizing of glass fibers used to reinforce thermoplastics, especially polyamide [See More]
- Features: Anti-static or ESD Control (optional feature)
- Chemical System: Polyurethane
- Material Type: Thermally cured
- Form / Shape: Liquid
from Integument Technologies, Inc.
Suitable for a wide variety of industrial and technological applications [See More]
- Features: Anti-static or ESD Control (optional feature); Electrically Conductive Compound (optional feature); EMI / RFI Shielding Material (optional feature)
- Chemical System: Fluoropolymer; Electroless or Vacuum Sputter Coated
- Material Type: Thermoplastic
- Filler: Unfilled
