Filler Material:Other Molding Compounds and Resins Datasheets

Hysol GR750 -- 8799375032321
from Henkel Corporation - Electronics

Hysol ® GR750 ™ are high thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys. [See More]

  • Filler: Filler: Alumina Filler, Filler: Crystalline Filler, Green - Environmentally Responsible Material
  • Industry: Electronics
  • Features: Thermally Conductive
  • Thermal Conductivity: 2.1
Pre-Preg Product -- NP101B
from Norplex-Micarta

NP101B pre-preg consists of woven nylon fabric combined with a high-temperature phenolic resin system. NP101B provides excellent electrical properties under high humidity conditions, good flexural, compressive, and impact strength at elevated temperatures, but the cold flow under load (creep) is... [See More]

  • Filler: Nylon Fabric
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Composite; Thermally cured
Ekonol® Polyester T-101
from Saint-Gobain Coating Solutions

Introduction. Ekonol Polyester is a very thermally stable polymer. When combined with polytetrafluoroethylene(PTFE), it produces composite materials that have excellent temperature and wear resistance. The Ekonol Polyester/PTFE blend are compatible with a wide range of mating surfaces; its... [See More]

  • Filler: PTFE
  • Type: Composite
VICTREX® PEEK Polymer -- 150FC30
from Victrex plc.

High performance thermoplastic material, 30% reinforced with carbon fibre / graphite / PTFE PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact compliant, colour black. Typical Application Areas. Tribological applications with thin cross... [See More]

  • Filler: Carbon or Graphite; PTFE
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Form / Shape: Pellets
FORTRON 0205 -- 326
from Celanese Corporation

FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 30 ° C. The time between drying and processing should be as short as possible. [See More]

  • Filler: LOW VISCOSITY, UNFIL
  • Chemical System: Polysulphide or Polyphenylene Sulphide
  • Type: Thermoplastic
  • Use Temperature: 230 to 248
Engineering Polymer Ketoprix™, Conductive -- EKT23G3C3L, EKT23G3C2L
from Esprix Technologies

PRODUCT CHARACTERISTICS. KetoprixTM EKT23G3C3 and EKT23G3C2 resins are thermoplastic aliphatic polyketone compounds containing the base 1,4-diketone polymer backbone structure with added fiber reinforcement and thermally conductive additives. Additional thermal stabilizers and lubricants are also... [See More]

  • Filler: Fiber Reinforcement and Thermally Conductive Additives
  • Industry: Automotive; OEM or Industrial
  • Type: Thermoplastic
  • Tensile (Break): 10153 to 13053
Xarec® N WA Grade -- 5030-02
from Idemitsu Chemical Co.

Offering more strength and ductility than the WA grades, the N WA grades have been formulated with Nylon 66 to create a unique blend that offers strength and ductility, in the complex tool designs frequently encountered underhood in automotive USCAR class 3 and 4 environments. The N WA7020-02 and N... [See More]

  • Filler: Glass or FRP; Nylon
  • Chemical System: Polyamide; Styrene or Polystyrene
  • Type: Thermoplastic
  • Form / Shape: Pellets
Molding Compound -- ZeMC² 3033HT
from Zeon Technologies, Inc.

We are also developing a line of bulk molding compounds through ZeMC ²,our sister company, that are second to none in the industry. We already have in the market place, through Carver Pump Composites, a Kevlar molding compound for high temperature pump seals that are virtually indestructible... [See More]

  • Filler: Kevlar
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Form / Shape: Pellets