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CSP/BallNest™Hybrid Socket
from Aries Electronics, Inc.

FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]

  • Features: ZIF Lock
  • Socket Type: BGA; CSP; LGA; SZIP
  • Product Type: IC Socket
  • Mounting: Through-Hole
ELK324
from Excel Cell Electronic USA Corp.

Housed in UL 94-0 fire retardant plastic [See More]

  • Features: ZIF Lock
  • Socket Type: DIP; ZIF Socket
  • Product Type: IC Socket
  • Mounting: Through-Hole