from Aries Electronics, Inc.
FEATURES. Any grid size pitch available from 0.20mm. Socket lid nests device into socket for a reliable connection. Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices. ZIF style socket using Aries solderless, Au-plated pressure mount Spring Probe. Special lid designs... [See More]
- Features: ZIF Lock
- Socket Type: BGA; CSP; LGA; SZIP
- Product Type: IC Socket
- Mounting: Through-Hole