Press-fit IC Sockets and Headers Datasheets

CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Mounting: Press-fit / Solderless Technology
  • Socket Type: CSP; Test
  • Product Type: IC Socket
  • Operating Temperature: -55 to 150
DIP SOCKET, 8, PRESS FIT VERTICAL -- 91K8243 [D2608-42 from HARWIN]
from Newark / element14

DIP SOCKET, 8, PRESS FIT VERTICAL; Connector Type:DIP Socket; No. of Contacts:8; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Termination:Press Fit Vertical; Contact Material:Beryllium Copper; Contact Plating:Gold [See More]

  • Mounting: Press-fit / Solderless Technology
  • RoHS Compliant: RoHS Compliant
  • Product Type: IC Socket
  • Socket Type: DIP