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Flip-Top™ BGA Socket Series
from Advanced Interconnections Corp.

Our Flip-Top ™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top ™ BGA Sockets require no external hold-downs and use... [See More]

  • Contact Type: Low Profile Pins (optional feature); Solder Tail Pins (optional feature); Spring Loaded
  • RoHS Compliant: RoHS Compliant (optional feature)
  • Product Type: IC Socket
  • Socket Type: BGA; LGA; Test
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher
from Aries Electronics, Inc.

Available with or without filters for UV, infrared and full spectrum applications, Aries ’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different... [See More]

  • Contact Type: Spring Loaded
  • Socket Type: CSP; Test
  • Product Type: IC Socket
  • Mounting: Press-fit / Solderless Technology
Spring Contact -- 09H9309 [1-380758-1 from TE Connectivity]
from Newark / element14

Spring Contact; Body Material:Copper; Body Plating:Tin; Features:Closed Bottom; For Use With:0.036 to 0.051 in. Mating Pin Diameter Range; Leaded Process Compatible:No; Overall Length:0.262"; Peak Reflow Compatible (260 C):No [See More]

  • Contact Type: Spring Loaded
  • Product Type: IC Socket