Surface Mount Adhesives -- Epibond® 7275
from Alpha

Epibond ® 7275-Series surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non stringing. Dispense,... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Gel; Die Bonding Adhesives
  • Cure / Technology: Two Component  
  • Industry: Electronics
Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics; OEM or Industrial
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: High Dielectric
  • Form / Shape: Liquid
3M™ Thermally Conductive Adhesive -- TC-2707
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Composition: Filled
  • Form / Shape: Liquid
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Composition: Filled
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Form / Shape: Liquid
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Industry: OEM or Industrial
Thermal Management Adhesive -- 3860
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Tuffbond™ -- 313
from Hernon Manufacturing, Inc.

Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Form / Shape: Die Bonding Adhesives; Grease, Paste