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Dow Corning Thermally Conductive Adhesive SE 9184 75ml White -- SE 9184 WHITE RTV 75ML
from Ellsworth Adhesives

One-part, white, moisture cure RTV, non-flowing, fast tack free, controlled volatility, thermally conductive, UL V-0. Recommended Applicator Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Non-corrosive
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Industry: Electronics; OEM or Industrial
Flexibilized, Thermally Conductive Epoxy Adhesive -- EP30FLAO
from Master Bond, Inc.

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of... [See More]

  • Features: Non-corrosive; Flexible; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Thermal Management Adhesive -- 5404
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Features: Non-corrosive
  • Chemical System: Silicone
  • Type: High Dielectric
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: Phase Change; Non-corrosive; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled