Non-corrosive Cure Thermal Compounds and Thermal Interface Materials Datasheets

Thermally Conductive, Dimensionally Stable Epoxy -- EP30AN
from Master Bond, Inc.

Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. It is formulated to cure at room temperature or more rapidly at... [See More]

  • Features: Non-corrosive; Flexible; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: Phase Change; Non-corrosive; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled