Phase Change Thermal Compounds and Thermal Interface Materials Datasheets

Hysol ECCOBOND TE3530
from Henkel Corporation - Industrial

One component, low temperature curing thermally conductive epoxy adhesive. [See More]

  • Features: Electrically Conductive; Phase Change
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Shape: Paste
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: Phase Change; Non-corrosive; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled