from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Features: Flame Retardant; Non-corrosive; Flexible
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Single Component; Adhesive Tape
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Features: Flexible; UL Rating; Dissimilar Substrates
- Chemical System: Alkyd
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Quist Electronics
Ultra-conforming, designed for fragile and low-stress applications [See More]
- Features: Flame Retardant; Flexible; UL Rating
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
from Sauereisen, Inc.
Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]
- Features: Flexible
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Thermon Manufacturing Co.
EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]
- Features: Flexible
- Form / Shape: Pad
- Cure / Technology: Single Component
- Industry: Electric Power; Heating Coil Systems
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Electrically Conductive; Flexible
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
