Flexible / Dampening Thermal Compounds and Thermal Interface Materials Datasheets

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: Flexible; UL Rating; Dissimilar Substrates
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Features: Non-corrosive; Flexible; Dissimilar Substrates
  • Composition: Unfilled
  • Type: High Dielectric
  • Cure / Technology: Thermoset
Flexible Heat Transfer Compound -- EFS-1
from Thermon Manufacturing Co.

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Features: Flexible
  • Form / Shape: Pad
  • Cure / Technology: Single Component
  • Industry: Electric Power; Heating Coil Systems
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Features: Flexible
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Gasket Replacer -- 910
from Hernon Manufacturing, Inc.

HERNON gasket Replacer anaerobic adhesives are single component, 100% active, ready-to-use get-like materials that cure at room temperature. Gasket Replacer products cure only after confinement (the nature of anaerobic adhesives) between mating surfaces. They remain wet during assembly. After curing... [See More]

  • Features: Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Electrically Conductive; Flexible
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Aluseal Adhesive Cement -- No. 2
from Sauereisen, Inc.

Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]

  • Features: Flexible
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled