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Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: Flexible; UL Rating; Dissimilar Substrates
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: High Dielectric
  • Form / Shape: Liquid
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Bond-Ply® 100 [Bond-Ply® 100 from Bergquist Company (The)]
from Quist Electronics

High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]

  • Features: Flame Retardant; UL Rating; Dissimilar Substrates
  • Form / Shape: Die Bonding Adhesives
  • Chemical System: Acrylic
  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Features: UL Rating
  • Form / Shape: Pad
  • Chemical System: Acrylic
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; UL Rating
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Flame Retardant; UL Rating
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Single Component
Nuts N' Bolts® -- 427
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of Nuts N ™ bolts ® adhesives & sealants. These anaerobic adhesives are designed for use with assemblies having threaded fasteners. They are single component, 100% active liquids that are self-hardening when air is omitted as between the mating... [See More]

  • Features: Phase Change; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Electrically Conductive; Flame Retardant; Flexible; UL Rating
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component