UL Approved Thermal Compounds and Thermal Interface Materials Datasheets

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Features: Flexible; UL Rating; Dissimilar Substrates
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
High Thermally Conductive and Non-Flammable Silicone Gel Sheet -- SARCON ® XR-e
from Fujipoly® America Corp.

Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adher e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency of the pads... [See More]

  • Features: UL Rating
  • Form / Shape: Gel; Pad; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0394 to 0.0787
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Features: UL Rating
  • Form / Shape: Pad
  • Chemical System: Acrylic
  • Industry: Electronics
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Features: Flame Retardant; UL Rating
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component  
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Type: High Dielectric
  • Form / Shape: Liquid
Nuts N' Bolts® -- 427
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of Nuts N ™ bolts ® adhesives & sealants. These anaerobic adhesives are designed for use with assemblies having threaded fasteners. They are single component, 100% active liquids that are self-hardening when air is omitted as between the mating... [See More]

  • Features: Phase Change; Non-corrosive; UL Rating; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: Flame Retardant; UL Rating
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Electrically Conductive; Flame Retardant; Flexible; UL Rating
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  

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