Flexibilized, Thermally Conductive Epoxy Adhesive -- EP30FLAO
from Master Bond, Inc.

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of... [See More]

  • Form / Shape: Liquid; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Form / Shape: Liquid; Encapsulant or Conformal Coating
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Form / Shape: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Electric Heater Cement -- No. 6
from Sauereisen, Inc.

Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply. [See More]

  • Form / Shape: Powder; Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled