Specialty / Other Thermal Compounds and Thermal Interface Materials Datasheets

Extremely Compressible Gap Filler -- SARCON® PG80A
from Fujipoly® America Corp.

Highly Conformable and Non-Flammable, Higher Thermal interface materials. SARCON ® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammableinterface materials. The surface consistency is excellent for filling small air gaps and uneven... [See More]

  • Type: High Dielectric
  • Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.0787
Hysol ECCOBOND E3503-1 -- 8799540346881
from Henkel Corporation - Electronics

Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes. [See More]

  • Industry: Electronics
  • Viscosity: 60000
  • Thermal Conductivity: 1
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
  • Form / Shape: Ribbon
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Epoxy; Polyurethane
  • Cure / Technology: Thermoset; Two Component