Aerospace Thermal Compounds and Thermal Interface Materials Datasheets

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Single Component, Electrically Insulating, Thermally Conductive Epoxy -- EPO-TEK® H63
from Epoxy Technology

A single component, electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK ® H62. [See More]

  • Industry: Aerospace; Electronics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military (optional feature); Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide (optional feature); Polypropylene (optional feature); Ceramic (optional feature); Acrylic (optional feature); Epoxy (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature); Silicone (optional feature); Polyamide (optional feature); Alkyd (optional feature); Phenolic (optional feature); Elastomeric (optional feature); Polyurethane (optional feature); Vinyl (optional feature); Polyethylene (optional feature)
  • Type: High Dielectric; Optical
  • Composition: Unfilled; Filled (optional feature)
Pyro-Putty® -- 1000
from Aremco Products, Inc.

For apps to 1/2in thick, repairs cast aluminum parts to 1400 °F [See More]

  • Industry: Aerospace; Automotive; OEM or Industrial; Boilers, Ovens, Pumps, Ducting, Turbines
  • Composition: Filled
  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Electronic Encapsulants
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component