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Molykote® 111 Compound
from Dow Corning Oil & Gas Solutions

Lubrication for control and pressure plug valves, water softener and faucet valves.Sealant for vacuum and pressure systems.Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure: meters, electrical service entrance and underground connections.Damping... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial
  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Use Temperature: -40 to 392
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Electronic Encapsulants
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Gap Filler 1000 [Gap Filler 1000 from Bergquist Company (The)]
from Quist Electronics

Ultra-conforming, designed for fragile and low-stress applications [See More]

  • Industry: Automotive; Electronics; OEM or Industrial; Semiconductors, IC's; Telecommunications
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
Pyro-Putty® -- 1000
from Aremco Products, Inc.

For apps to 1/2in thick, repairs cast aluminum parts to 1400 °F [See More]

  • Industry: Aerospace; Automotive; OEM or Industrial; Boilers, Ovens, Pumps, Ducting, Turbines
  • Composition: Filled
  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component