Electronics Thermal Compounds and Thermal Interface Materials Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Grease, Paste
Surface Mount Adhesives -- Epibond® 7275
from Alpha

Epibond ® 7275-Series surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non stringing. Dispense,... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Gel; Die Bonding Adhesives
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Industry: Electronics
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Extremely Compressible Gap Filler -- SARCON® PG80A
from Fujipoly® America Corp.

Highly Conformable and Non-Flammable, Higher Thermal interface materials. SARCON ® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammableinterface materials. The surface consistency is excellent for filling small air gaps and uneven... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: High Dielectric
  • Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
Gap Pad 1000HD -- 8806383648769
from Henkel Corporation - Electronics

Gap Pad ® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad ® 1000HD allows excellent... [See More]

  • Industry: Electronics
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: High Dielectric
  • Composition: Filled
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Industry: Electronics
  • Form / Shape: Pad
  • Chemical System: Acrylic
  • Features: UL Rating
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Electronics; Electric Power; Semiconductors, IC's
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial; Telecommunications, IT
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Single Component; Adhesive Tape
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Industry: Electronics; Electric Power
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset; Two Component  
  • Type: High Dielectric
  • Form / Shape: Liquid
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Thermal Grease
from PENCOM

For heat sinks/spreaders in virtually any commercially available material [See More]

  • Industry: Electronics
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled