The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
Industry: Aerospace; Electronics; Military; OEM or Industrial; Telecommunications, IT
Composition: Filled
Chemical System: Silicone
Cure / Technology: Single Component; Adhesive Tape
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Electronic Encapsulants
Composition: Filled
Chemical System: Epoxy
Cure / Technology: Thermoset; Two Component
Similar parts from ITW Polymer Technologies - Insulcast Division
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Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Chemical/Oil Processing/Metal Working
Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
