Electrically and Thermally Conductive Adhesive -- EK1000-MP
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Designed specifically to meet the requirements pertaining to the... [See More]

  • Industry: Electronics; Military; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Chemical/Oil Processing/Metal Working
  • Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
  • Type: High Dielectric
  • Composition: Filled
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial; Telecommunications, IT
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Single Component; Adhesive Tape
High Thermal K Heat Transfer Epoxy -- 50-3100
from Epoxies Etc...

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]

  • Industry: Electronics; Electric Power; Military
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled