from Acrolab Ltd.
Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]
- Industry: OEM or Industrial; Heat Transfer Systems
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Form / Shape: Grease, Paste
from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Industry: Aerospace; Electronics; Military; OEM or Industrial; Telecommunications, IT
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Single Component; Adhesive Tape
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
- Chemical System: Alkyd
- Type: High Dielectric
- Composition: Filled
from Ellsworth Adhesives
A highly filled, medium viscosity black casting resin. [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Liquid
from ITW Polymer Technologies - Insulcast Division
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Electronic Encapsulants
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives
- Chemical System: Acrylic
- Features: Flame Retardant; UL Rating; Dissimilar Substrates
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Industry: OEM or Industrial
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from GS Polymers, Inc.
Two part, 1:1, thermal conductive compound, available in cartridges [See More]
- Industry: OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Form / Shape: Gel; Die Bonding Adhesives
