OEM / Industrial Thermal Compounds and Thermal Interface Materials Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Grease, Paste
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military (optional feature); Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide (optional feature); Polypropylene (optional feature); Ceramic (optional feature); Acrylic (optional feature); Epoxy (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature); Silicone (optional feature); Polyamide (optional feature); Alkyd (optional feature); Phenolic (optional feature); Elastomeric (optional feature); Polyurethane (optional feature); Vinyl (optional feature); Polyethylene (optional feature)
  • Type: High Dielectric; Optical
  • Composition: Unfilled; Filled (optional feature)
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Industry: OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Electronic Encapsulants
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled