Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Grease, Paste
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Industry: Aerospace; Automotive; Electric Power; OEM or Industrial
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Industry: OEM or Industrial
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Industry: OEM or Industrial
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled