Optoelectronics / Photonics Thermal Compounds and Thermal Interface Materials Datasheets

Electrical -- EJ2189
from Epoxy Technology

An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component