Optoelectronics / Photonics Thermal Compounds and Thermal Interface Materials Datasheets

Electrically Conductive Epoxy -- H20E-FC
from Epoxy Technology

Product Description: EPO - TEK ® H20E - FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. EPO-TEK ® H20E-FC Advantages & Application Notes: It is a snap cure version of EPO-TEK... [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
One Component, High Purity, Silver Conductive Epoxy -- EP19SC
from Master Bond, Inc.

Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically... [See More]

  • Industry: Electronics; Electric Power; Photonics
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component