Semiconductors / IC Packaging Thermal Compounds and Thermal Interface Materials Datasheets

Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Extremely Compressible Gap Filler -- SARCON® PG80A
from Fujipoly® America Corp.

Highly Conformable and Non-Flammable, Higher Thermal interface materials. SARCON ® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammableinterface materials. The surface consistency is excellent for filling small air gaps and uneven... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: High Dielectric
  • Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Industry: Semiconductors, IC's
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military (optional feature); Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Polyphenylene Sulfide (optional feature); Polypropylene (optional feature); Ceramic (optional feature); Acrylic (optional feature); Epoxy (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature); Silicone (optional feature); Polyamide (optional feature); Alkyd (optional feature); Phenolic (optional feature); Elastomeric (optional feature); Polyurethane (optional feature); Vinyl (optional feature); Polyethylene (optional feature)
  • Type: High Dielectric; Optical
  • Composition: Unfilled; Filled (optional feature)
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Aremco-Bond™ -- 860
from Aremco Products, Inc.

Exceptional mechanical and thermal properties [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Electronics; Electric Power; Semiconductors, IC's
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Fast Gelling Polyurethane Compound -- 50-2370
from Epoxies Etc...

50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives