Techspray Silicone Free Heat Sink Compound 4 oz Aerosol -- 1978-DP
from Ellsworth Adhesives

Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk). [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Does Not Harden
  • Composition: Filled
  • Form / Shape: Grease, Paste
Electrical -- B9126-8
from Epoxy Technology

A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure, and syringe dispensing rheology. It can be used for electrical connections when... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Industry: Semiconductors, IC's
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Form / Shape: Grease, Paste
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Aremco-Bond™ -- 860
from Aremco Products, Inc.

Exceptional mechanical and thermal properties [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Industry: Electronics; Electric Power; Semiconductors, IC's
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Fast Gelling Polyurethane Compound -- 50-2370
from Epoxies Etc...

50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives