Room Temp. Cure / Vulcanizing Thermal Compounds and Thermal Interface Materials Datasheets

Electrically Conductive Epoxy -- EPO-TEK® EJ2189
from Epoxy Technology

An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
LOCTITE 3873 -- 8799552208897
from Henkel Corporation - Electronics

LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Thermal Conductivity: 1.25
  • Industry: Electronics
  • Viscosity: 200000
Epoxy Adhesive with Ultra Low Thermal Resistance -- EP48TC
from Master Bond, Inc.

For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Composition: Filled
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Aremco-Bond™ -- 616
from Aremco Products, Inc.

Aremco-Bond ™ 616 [See More]

  • Cure / Technology: Thermoset (optional feature); Room Temperature Vulcanizing or Curing (optional feature)
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Hapcoat™ 3726 Aluminum Filled Gel Coat -- 3726
from Hapco, Inc.

HAPCOAT ™ 3726 is an aluminum filled, high temperature, gel coat. HAPCOAT ™ 3726 is a high heat resistant, thixotropic, gel coat that is specifically designed to reproduce surface details exactly and eliminate print through. When HAPCOAT ™ 3726 is used with HAPCURE 7 curing agent,... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Gel
  • Composition: Filled
  • Use Temperature: 350 to 400
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
INSULCAST RTVS-3-95-1 Low Viscosity, High Thermal Conductivity Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, UL recognized under file E86165 for flame class 94V-0. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Silicone
  • Form / Shape: Gel; Die Bonding Adhesives; Encapsulant or Conformal Coating