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Hapcoat™ 3726 Aluminum Filled Gel Coat -- 3726
from Hapco, Inc.

HAPCOAT ™ 3726 is an aluminum filled, high temperature, gel coat. HAPCOAT ™ 3726 is a high heat resistant, thixotropic, gel coat that is specifically designed to reproduce surface details exactly and eliminate print through. When HAPCOAT ™ 3726 is used with HAPCURE 7 curing agent,... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Gel
  • Composition: Filled
  • Use Temperature: 350 to 400
INSULCAST RTVS-3-95-1 Low Viscosity, High Thermal Conductivity Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, UL recognized under file E86165 for flame class 94V-0. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Silicone
  • Form / Shape: Gel; Die Bonding Adhesives; Encapsulant or Conformal Coating
One Component, Thermally Conductive Silicone -- MS705TC
from Master Bond, Inc.

Master Bond MasterSil 705TC is an easy-to-use, one component, thermally conductive, electrically isolating, high performance silicone for bonding, sealing and coating. The material is an off-white colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture and is a... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste; Encapsulant or Conformal Coating
Gap Filler 1000 [Gap Filler 1000 from Bergquist Company (The)]
from Quist Electronics

Ultra-conforming, designed for fragile and low-stress applications [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
  • Industry: Automotive; Electronics; OEM or Industrial; Semiconductors, IC's; Telecommunications
Similar parts from Quist Electronics
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Thermal Management Adhesive -- 5406
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Type: High Dielectric
  • Composition: Filled