Techspray Silicone Free Heat Sink Compound 4 oz Aerosol -- 1978-DP
from Ellsworth Adhesives

Product will not harden, dry out, melt, or contaminate wave solder baths. Designed to eliminate the phenomenon of silicone migration. Product has a functional temperature range from -40C (-40F) to 200C (392F). Sold as a pack (24/pk). [See More]

  • Cure / Technology: Does Not Harden
  • Form / Shape: Grease, Paste
  • Composition: Filled
  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
  • Form / Shape: Ribbon
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy; Polyurethane
  • Type: High Dielectric
  • Composition: Filled
3M™ Thermally Conductive Grease -- TCG-2031
from 3M Electronics Design & Manufacturing

Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. [See More]

  • Cure / Technology: Single Component; Non-Curing
  • Form / Shape: Grease, Paste
  • Composition: Filled
  • Industry: Electronics
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Cure / Technology: Two Component  ; Chemically Set
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled