from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled