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Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Alkyd
  • Cure / Technology: Thermoset; Single Component
Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: UV or Radiation Cured; Single Component
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
Elastomeric potting & encapsulating compound -- 20-2121
from Epoxies Etc...

20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Form / Shape: Grease, Paste
Thermal Management Adhesive -- 315
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Thermoset; Single Component
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives