EMI / RFI Shielding Material Thermal Compounds and Thermal Interface Materials Datasheets

Electrically Conductive Epoxy -- EPO-TEK® EJ2189
from Epoxy Technology

An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
  • Chemical System: Epoxy; Polyurethane
  • Type: High Dielectric
  • Composition: Filled