from Master Bond, Inc.
Master Bond Polymer System EP30-2SP is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/25 mix ratio by weight. This resin system is 100% reactive and... [See More]
- Type: High Dielectric; Optical
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component