Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Shape: Grease, Paste
  • Composition: Unfilled
  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Filled
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Type: High Dielectric
  • Industry: Electronics
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Flexibilized, Thermally Conductive Epoxy Adhesive -- EP30FLAO
from Master Bond, Inc.

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Thermcoat Cement & Lacquer Kit -- THERMCOAT Series
from OMEGA Engineering, Inc.

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

  • Cure / Technology: Thermoset (optional feature); Single Component
  • Form / Shape: Liquid (optional feature); Powder (optional feature)
  • Chemical System: Ceramic
  • Use Temperature: -229 to 446
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Cure / Technology: Thermoset
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Filled
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Chemical System: Polyurethane
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Composition: Unfilled
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Shape: Gel; Die Bonding Adhesives
  • Composition: Unfilled
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages