Unfilled Thermal Compounds and Thermal Interface Materials Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Cure / Technology: UV or Radiation Cured; Single Component
One Component Thermally Conductive Epoxy Film -- FL901AO
from Master Bond, Inc.

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Single Component
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electronics; Semiconductors, IC's
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Composition: Unfilled
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Cure / Technology: Single Component