Unfilled Thermal Compounds and Thermal Interface Materials Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; OEM or Industrial; Heat Transfer Systems
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset
  • Type: High Dielectric
  • Form / Shape: Pellets; Gap Filler, Foam in Place Gasket
Epoxy potting and encapsulating resin -- 20-3001NC
from Epoxies Etc...

20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its ’ convenient 1:1 mix ratio and lack of fillers make it an ideal material for meter... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electronics; Semiconductors, IC's
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Composition: Unfilled
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Cure / Technology: Single Component