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Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Cure / Technology: UV or Radiation Cured; Single Component
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Heat Curing, Thermally Conductive Epoxy -- S10AN
from Master Bond, Inc.

Master Bond Polymer Adhesive SUPREME10AN represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high peel strengths, plus exceptionally high thermal conductivity. This one component adhesive system is... [See More]

  • Composition: Unfilled
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electronics; Semiconductors, IC's
Gap Filler 1000 [Gap Filler 1000 from Bergquist Company (The)]
from Quist Electronics

Ultra-conforming, designed for fragile and low-stress applications [See More]

  • Composition: Unfilled
  • Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Automotive; Electronics; OEM or Industrial; Semiconductors, IC's; Telecommunications
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Composition: Unfilled
  • Chemical System: Acrylic
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating