BGA Electronic and IC Packaging Services Datasheets
from Advanced Technical Ceramics Company
AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non-captive supplier of... [See More]
- Type: BGA; MCM; LCCC; Custom Pin Grid Arrays
- Backend Processing: Soldering / Pasting; Hermetic Sealing; Dicing
- Company Information: AdTech Ceramics has 30+ years of multilayer ceramic (MLC) manufacturing and 15+ years of AlN Multilayer technology experience, and offers microwave modeling and design and developmental partnerships.
- Material: Ceramic; Co-fired Metal Ceramic Packages
from Twilight Technology Inc.
Twilight Technology, Inc. specializes in IC packaging and testing services focused on providing solutions for high reliability applications or obsolete components. Twilight Technology has manufactured and marketed a variety of standard and proprietary semiconductor packaging and memory module... [See More]
- Type: BGA
- Mounting: SMount
- Company Information: Twilight Technology, Inc. is the leading manufacture of non-standard memory solutions which are made available for the Defense, Energy, Industrial, and Aviation markets.
- Backend Processing: FlipChip