MIM Copper
from Kinetics Metal Injection Molding

Material Description: Offers very good thermal management and electrical conductivity and a lower thermal expansion co efficient than aluminum. Often used for heat sinks, fuel cells, sensors, high speed computer processor chips and applications where miniaturization, sophisticated design and... [See More]

  • Applications: Battery / Fuel Cell; Electronics or semiconductors; Heat Sinks
  • Shape / Form: Fabricated Parts or Shapes (Castings, Forgings, Machined Parts, etc.)
  • Type: Pure Copper or Very Low Alloy
  • Features: Powder Metal Parts or Stock