Copper (Pure / Low Alloy) Copper, Brass, and Bronze Alloys Datasheets

Photovoltaic Solder -- Alpha® PV Ready Ribbon
from Alpha Assembly Solutions

ALPHA ® PV-READY RIBBON ® (Ready Ribbon ®) is a flux coated photovoltaic (PV) ribbon designed to increase through-put for companies producing cSi solar modules. Our pre-fluxed Ready Ribbon ® eliminates the need for module assemblers to apply liquid flux during either manual or... [See More]

  • Type: Pure Copper or Very Low Alloy
  • Shape / Form: Semi-finished, Mill Stock or Near Net Shapes
  • Tempers & Finishes: Solder Coated
  • UTS: 29007 to 52213
EasyBond-SP™ Tabbing/Interconnect Wire
from Ulbrich Stainless Steels & Special Metals, Inc.

EasyBond-SP ™ (tinned) is a high efficiency cell interconnect and tabbing wire engineered specifically for use with conductive adhesives.  This non-soldered, innovative solar cell tabbing was developed to increase the power output of a solar module by optimizing the cross section as well as... [See More]

  • Type: Pure Copper or Very Low Alloy
  • CDA Grade: 102 to 110
  • UNS C: 10200 to 11000
  • Specifications: ASTM / ASME; CDA; UNS
97/3
from Bellman-Melcor LLC

Used for centuries as a means of joining metals together, solders are ideal for lower temperature applications. Since our founding in 1963, Bellman-Melcor has been providing the highest quality solder alloys and fluxes to meet our customers unique requirements and applications.With more than 150... [See More]

  • Type: Pure Copper or Very Low Alloy
  • Shape / Form: Powder, Granule or Flake; Wire; Fabricated Parts or Shapes (Castings, Forgings, Machined Parts, etc.)
MIM Copper
from Kinetics Metal Injection Molding

Material Description: Offers very good thermal management and electrical conductivity and a lower thermal expansion co efficient than aluminum. Often used for heat sinks, fuel cells, sensors, high speed computer processor chips and applications where miniaturization, sophisticated design and... [See More]

  • Type: Pure Copper or Very Low Alloy
  • Features: Powder Metal Parts or Stock
  • Shape / Form: Fabricated Parts or Shapes (Castings, Forgings, Machined Parts, etc.)
  • Applications: Battery / Fuel Cell; Electronics or semiconductors; Heat Sinks
Engineered Materials -- Pure Metals
from Materion Corporation

Pure Metals. Aluminum, Al. Neodymium, Nd. Antimony, Sb. Nickel, Ni. Beryllium, Be. Niobium, Nb. Bismuth, Bi. Osmium, Os. Boron, B. Palladium, Pd. Cadmium, Cd. Platinum, Pt. Calcium, Ca. Praseodymium, Pr. Carbon, C. Rhenium, Re. Cerium, Ce. Rhodium, Rh. Chromium, Cr. Ruthenium, Ru. Cobalt, Co. [See More]

  • Type: Pure Copper or Very Low Alloy
  • Applications: Electronics or semiconductors
  • Shape / Form: Semi-finished, Mill Stock or Near Net Shapes
C11000 Electrolytic Tough Pitch Copper -- Rounds
from National Bronze & Metals Inc.

C11000 Electrolytic Tough Pitch Copper CDA 110 ETP, ASTM B124, ASTM B152, ASTM B187, ASTM B188, ASTM B272. High electrical and thermal conductivity, good corrosion resistance and solderability. C11000 is used for welding fixtures, anodes, bus bar in electrical power installations, ground straps,... [See More]

  • Type: Pure Copper or Very Low Alloy
  • CDA Grade: 110
  • UNS C: 11000
  • Specifications: AMS; ASTM / ASME; CDA; MIL-SPEC / QQS; SAE; UNS; ASTM B-127
Performance Copper Foil -- DBT III Series
from Oak-Mitsui, Inc.

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and application specific copper foils required by... [See More]

  • Type: Pure Copper or Very Low Alloy
  • Shape / Form: Foil; Semi-finished, Mill Stock or Near Net Shapes
  • Tempers & Finishes: Electrodeposited, 125 to 450 microinch Rmax
  • UTS: 52500 to 60000