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3M™ Scotch-Weld™ Epoxy Adhesive 1386 Cream, 1 Quart, 12 per case -- EC1386
from 3M Industrial Adhesives and Tapes

3M ™ Scotch-Weld ™ Epoxy Adhesive 1386 is a one-part heat curing high viscosity epoxy adhesive. High temperature strength. Impact resistant. High peel strength. General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, metal bonding, transportation... [See More]

  • Chemical System: Epoxy
  • Viscosity: 75000 to 175000
  • Industry: Electronics
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Form / Shape: Liquid
  • Composition: Two Component  ; Unfilled
AIRSTONE™ Adhesive System
from Dow Polyurethanes

The AIRSTONE ™ Adhesive System consists of an epoxy resin and two epoxy hardeners with different pot lives. This solvent free, highly thixotropic adhesive has been optimized to meet the stringent requirements of composite wind turbine manufacturing. Applications. This AIRSTONE Adhesive System... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electric Power
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Sympoxy™ Thermosetting Material -- 1002/29
from Hapco, Inc.

Heat cure epoxy powder that is lightweght and passes 94 V-0 testing. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY -- 048011-65138
from R. S. Hughes Company, Inc.

3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electric Power
3M™ Scotch-Weld™ Adhesive -- DP-460 EG
from 3M Electronics Design & Manufacturing

Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Form / Shape: Liquid
  • Industry: Electronics
Double/Bubble® Epoxy Adhesive -- 4001 [4001 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Liquid
  • Industry: Electronics
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Thermoset
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Cure / Technology: UV or Radiation Cured
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics; Electric Power
604057 [CW2400 from Circuit Works]
from Farnell Europe

ADHESIVE, SILVER EPOXY, CONDUCTIVE [See More]

  • Chemical System: Epoxy
  • Industry: Semiconductors, IC's
ENCAPTRAX™ 121
from Glotrax Polymers Inc.

A two part epoxy potting compound specially formulated with a 1:1 mix ratio for the convenience of dispensing it from a side-by-side cartridge system. Encaptrax 121 is a flowable, industrial grade potting compound with an extended work life. Once mixed, the epoxy cures at room temperature to form a... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Air Setting / Film Drying; Thermoset
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Use: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Electronics
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Use: Die Bonding Adhesives
  • Composition: Two Component  
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset