from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy adhesive. 4:5 mix ratio, 60 minute work life and handling strength in approximately 8 hours. This kit contains 1.6 fl. oz. of part B and 2 fl. oz. of part A. 60 minute worklife. High viscosity. Rigid bonds. General... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Form / Shape: Grease, Paste
- Composition: Two Component
- 3M™ Scotch-Weld™ Epoxy Adhesive 1838L Translucent, Part B/A, 2 fl oz Tube Kit, 6 per case -- 62352005359,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Density Gray, 6 fl oz Plastic Cartridge, 6 per case -- 62341429306,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp Gray, 6 fl oz, 6 per case -- 62340229301,
from Andover Corporation
Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200 °F and is available in premeasured kits. USES. [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Use: Encapsulant, Potting Compound
- Industry: Photonics
from Applied Industrial Technologies
- Chemical System: Epoxy
- Industry: Electronics
- Form / Shape: Liquid
- Composition: Two Component ; Unfilled
from Device Technologies, Inc.
Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It ’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast ™ Edge Trim, Seal-Fast... [See More]
- Chemical System: Epoxy; Polyamide (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature)
- Form / Shape: Powder; Reel to Reel
- Use: Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Ellsworth Adhesives
CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Electronics
from Hapco, Inc.
Heat cure epoxy powder that is lightweght and passes 94 V-0 testing. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from ITW Polymer Technologies - Insulcast Division
INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Industry: Semiconductors, IC's; Electronics; Electric Power
from R. S. Hughes Company, Inc.
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]
- Chemical System: Epoxy
- Industry: Electronics
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Liquid
- Industry: Electric Power
from 3M Electronics Markets Materials Division
Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]
- Chemical System: Epoxy
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Liquid
- Industry: Electronics
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured
from Farnell Europe
ADHESIVE, SILVER EPOXY, CONDUCTIVE [See More]
- Chemical System: Epoxy
- Industry: Semiconductors, IC's
from Glotrax Polymers Inc.
A two part epoxy potting compound specially formulated with a 1:1 mix ratio for the convenience of dispensing it from a side-by-side cartridge system. Encaptrax 121 is a flowable, industrial grade potting compound with an extended work life. Once mixed, the epoxy cures at room temperature to form a... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Air Setting / Film Drying; Thermoset
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Chemical System: Epoxy
- Form / Shape: Gel
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
from Koford Engineering, LLC
E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
- Form / Shape: Grease, Paste
- Industry: Electronics
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Use: Die Bonding Adhesives
- Composition: Two Component
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset
