Specialty / Other Electrical and Electronic Resins Datasheets

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Chemical System: PFA
  • Industry: Electronics
  • Form / Shape: Pellets
  • Tensile (Break): 5221
ELAN-Cast® -- Y-363A Resin / Y-363B Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Natural Oil Base
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Ablestik ABLELUX LA-1UV -- 8799473631233
from Henkel Corporation - Electronics

Single component, photocurable adhesive is designed for bonding camera module assemblies. [See More]

  • Chemical System: Hybrid Chemistry
  • Industry: Electronics
  • Cure / Technology: UV or Radiation Cured
  • Composition: Single Component
Engineered Solder Materials -- Indalloy® Alloys Liquid at Room Temperature
from Indium Corporation

Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Liquid
  • Features: Thermally Conductive
One Component, Electrically Conductive Coating System -- MB600G
from Master Bond, Inc.

Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]

  • Chemical System: Sodium Silicate System
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Semiconductors, IC's; Electronics; Electric Power
ThermaCool® TF Series Thermally Conductive Silicon Coated Fabric -- TF1818
from Saint-Gobain Foams and Tapes

Thermally Conductive Silicone Coated Fabrics. Thermacool ® Coated Fabrics offer high temperature resistance and conformability as a low cost heat sink gasket. [See More]

  • Chemical System: Silicone; Fiberglass
  • Industry: Electronics
  • Form / Shape: Pad (optional feature)
  • Features: Flame Retardant; Thermally Conductive; UL Rating
Aremco-Seal™ -- 613
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Chemical System: Glass
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Air Setting / Film Drying
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Chemical System: Epoxy; Adjustable Flexibility Epoxy
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Chemical System: Acrylic; Dimethacrylate Ester
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Anaerobic; Room Temperature Vulcanizing or Curing; Thermoset
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Chemical System: Synthetic Based
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Semiconductors, IC's; Electronics
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power