Specialty / Other Electrical and Electronic Resins Datasheets

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Chemical System: PFA
  • Industry: Electronics
  • Form / Shape: Pellets
  • Tensile (Break): 5221
ELAN-Cast® -- Y-363A Resin / Y-363B Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Natural Oil Base
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Ablestik ABLELUX LA-1UV -- 8799473631233
from Henkel Corporation - Electronics

Single component, photocurable adhesive is designed for bonding camera module assemblies. [See More]

  • Chemical System: Hybrid Chemistry
  • Industry: Electronics
  • Cure / Technology: UV or Radiation Cured
  • Composition: Single Component
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Chemical System: Metal
  • Industry: Semiconductors, IC's
  • Form / Shape: Sheet or Film
  • Features: Thermally Conductive
High Temperature Resistant Two Component Epoxy -- EP21HT
from Master Bond, Inc.

Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up to 400 °F. EP21HT produces high strength, durable bonds that hold up well to thermal cycling and resist many... [See More]

  • Chemical System: Epoxy; 100% Solids
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic / Hot Melt
Aremco-Seal™ -- 613
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Chemical System: Glass
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Cure / Technology: Air Setting / Film Drying
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Chemical System: Epoxy; Adjustable Flexibility Epoxy
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Chemical System: Acrylic; Dimethacrylate Ester
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Anaerobic; Room Temperature Vulcanizing or Curing; Thermoset
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Electronics; Electric Power