from Applied Industrial Technologies
300 mL Cartridge; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]
- Use: Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic / Hot Melt
- Chemical System: Acrylic; Silicone
- Industry: Photonics; Electronics
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Ellsworth Adhesives
Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Acrylic
- Form / Shape: Gel
- Cure / Technology: UV or Radiation Cured
from Hi-Tech Seals, Inc.
Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Cyanoacrylate
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from ITW Polymer Technologies - Insulcast Division
RTVS 12 is a multi-purpose compound designed for use as an encapsulant, sealant, potting and mold making material. RTVS 12 exhibits excellent electrical properties, low temperature flexibility and high temperature stability. A variety of catalysts are available for different cure situations. (See... [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Industry: Semiconductors, IC's; Electronics; Electric Power
from Quist Electronics
Ultra-conforming, designed for fragile and low-stress applications [See More]
- Use: Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Form / Shape: Liquid
- Industry: Semiconductors, IC's; Electronics
from 3M Fire Protection
Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
- Form / Shape: Liquid
- Cure / Technology: Air Setting / Film Drying
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Form / Shape: Grease, Paste
- Composition: Single Component
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Air Setting / Film Drying
from H2O Control Products, Inc.
Splice Filling Gel - available in a range of sizes & formats [See More]
- Use: Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Form / Shape: Gel
- Composition: Single Component
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured
from Novagard Solutions
Non-corrosive, single component silicone compound, non-flowable [See More]
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]
- Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Form / Shape: Liquid
- Cure / Technology: Thermoset
