587 Blue RTV Gasket Maker 300 ml -- 58775 [58775 from Henkel Corporation]
from Applied Industrial Technologies

300 mL Cartridge; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoplastic / Hot Melt
  • Chemical System: Acrylic; Silicone
  • Industry: Photonics; Electronics
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic
  • Form / Shape: Gel
  • Cure / Technology: UV or Radiation Cured
Thermal -- TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Industry: Semiconductors, IC's; Electronics; Electric Power
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Composition: Single Component
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Epoxy Adhesive -- 10-3022
from Epoxies Etc...

10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Air Setting / Film Drying
H2O Splice Control Gel Compound -- H2OSCGC
from H2O Control Products, Inc.

Splice Filling Gel - available in a range of sizes & formats [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Industry: Electronics
  • Form / Shape: Gel
  • Composition: Single Component
Circuit Board Protection -- 5084
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic; Dimethacrylate Ester
  • Form / Shape: Liquid
  • Cure / Technology: Anaerobic; Room Temperature Vulcanizing or Curing; Thermoset
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset