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Optical -- 301
from Epoxy Technology

Product Description: EPO-TEK ® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK ® 301 Advantages & Suggested Application Notes: • Semiconductor: optical glob top or underfill; adhesion to common... [See More]

  • Use: Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
One Component, UV Curable Glob Top Compound -- UV15X-2GT
from Master Bond, Inc.

Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]

  • Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
  • Cure / Technology: UV or Radiation Cured
  • Form / Shape: Liquid
  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
Hysol® Encapsulant -- CB011R-3
from Henkel Corporation - Electronics

Self-leveling, one-step cure, meets JEDEC requirements [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Use: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset