from 3M Industrial Adhesives & Tapes Canada
3M ™ High Tack Pressure Sensitive Adhesive 3794B is a 100% solids thermoplastic, general purpose, high tack, pressure sensitive adhesive that can be spray or bead applied. Sprayable. High tack pressure sensitive adhesive (PSA). 100 percent solids. Woodworking, furniture, automotive,... [See More]
- Industry: Electronics
- Chemical System: Block Co-Polymer
- Form / Shape: Pellets
- Cure / Technology: Contact or Pressure Sensitive Adhesives
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 1.6 fl oz/47 mL, 12 per case -- 62328814355,
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 13.53 fl oz/400 mL, 6 per case -- 62328835301,
- 3M™ Scotch-Weld™ Acrylic Adhesive DP805 Light Yellow, 6.76 fl oz/200 mL, 12 per case -- 62328838305,
from Applied Industrial Technologies
.5 mL Capsule; Blue; General-Purpose, Removable Threadlocker for Fasteners Between 1/4" and 3/4"; Parts Can Be Separated Using Hand Tools [See More]
- Industry: Photonics; Electronics
- Chemical System: Acrylic
- Form / Shape: Liquid
- Cure / Technology: Anaerobic; Thermoplastic / Hot Melt
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from Device Technologies, Inc.
Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It ’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast ™ Edge Trim, Seal-Fast... [See More]
- Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
- Form / Shape: Powder; Reel to Reel
- Use: Encapsulant or Conformal Coating
- Chemical System: Epoxy; Polyamide (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature)
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Air Setting / Film Drying
from Ellsworth Adhesives
CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured
from ITW Polymer Technologies - Insulcast Division
INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Newark / element14
HEAT SINK COMPOUND, WHT SYRINGE 1OZ; Sealant Applications:Electronics; Color:White; Dispensing Method:Syringe; Volume:1fl.oz. (US) [See More]
- Industry: Electronics
from Quist Electronics
High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]
- Industry: Semiconductors, IC's; Electronics
- Form / Shape: Sheet or Film
- Use: Die Bonding Adhesives
- Chemical System: Acrylic
from R. S. Hughes Company, Inc.
3M(TM) Light Cure Adhesive LC1110 Colorless, 30 cu cm, 6 per bag. One-component, medium viscosity adhesive that cures rapidly when exposed to UV light to form a semi-rigid bond. Features include: cures with UV light, cures in seconds, cures to tack-free surface, and has low corrosion properties. [See More]
- Industry: Electronics
from Sanchem, Inc.
is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Gel
- Use: Impregnating Resin
- Cure / Technology: Non-Drying
from Wacker Chemical Corp.
ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Composition: Single Component
from 3M Electronics Markets Materials Division
In most cases, when you send a label into the elements, you hope it will hold up and look good for years to come. Temperature extremes, moisture, and sunlight can all take their toll. Legibility may be critical. Look to 3M for label solutions that last. [See More]
- Industry: Electronics
- Composition: Single Component; Unfilled
- Chemical System: Acrylic
- Features: UL Rating
from 3M Fire Protection
Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Industry: Electronics
- Form / Shape: Grease, Paste
- Use: Gap Filler, Foam in Place Gasket
- Composition: Single Component
from Anti-Seize Technology
Most versatile instant adhesive, fast overall cure speed, regular viscosity [See More]
- Industry: Electronics
- Chemical System: Cyanoacrylate
- Form / Shape: Liquid
- Cure / Technology: Air Setting / Film Drying
from Bayer MaterialScience LLC
Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]
- Industry: Electronics
- Chemical System: PMDI
- Form / Shape: Liquid
- Cure / Technology: Thermoplastic / Hot Melt
from Dielectric Polymers, Inc.
Mounting nameplates, signs, graphic panels, and decorative trim [See More]
- Industry: Electronics
- Form / Shape: Sheet or Film
- Use: Die Bonding Adhesives
- Chemical System: Acrylic
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Industry: Electronics
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Farnell Europe
SEALANT, SILICONE, CLEAR, 310ML [See More]
- Industry: Electronics
- Chemical System: Silicone
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Industry: Electronics
- Form / Shape: Gel
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from H2O Control Products, Inc.
MAC Industrial Gel 10 oz. Caulking Tube [See More]
- Industry: Electronics
- Composition: Single Component
- Form / Shape: Gel
- Features: Moisture Absorbing
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Use: Die Bonding Adhesives
- Composition: Filled
from Koford Engineering, LLC
E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Composition: Two Component
from Novagard Solutions
Single component, moisture cured silicone rubber, strong durable sealant [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Industry: Semiconductors, IC's; Electronics; Electric Power
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from Scapa Group plc
U691 [See More]
- Industry: Electronics
- Chemical System: Acrylic
from Shin-Etsu Silicones of America
Excellent adhesion to many substrates [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Shape: Gel
- Cure / Technology: Room Temperature Vulcanizing or Curing
from SuperLogics, Inc.
3000 °F high purity, rapid curing alumina adhesive - 4 oz. bottle [See More]
- Industry: Electronics; Electric Power
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Alumina
