Electronics Electrical and Electronic Resins Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Composition: Single Component; Unfilled
Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Industry: Electronics
  • Chemical System: PFA
  • Form / Shape: Pellets
  • Tensile (Break): 5221
Surface Mount Adhesives -- Epibond® 7275
from Alpha

Epibond ® 7275-Series surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non stringing. Dispense,... [See More]

  • Industry: Electronics
  • Form / Shape: Gel
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
567™ PST® Thread Sealant -- 56747 [56747 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

50 mL Tube; Withstands Temperatures to 400 °F w/Excellent Solvent Resistant; Locks and Seals Tapered Pipe Threads and Fittings, Including High Pressure Applications; Disassembles w/Hand Tools [See More]

  • Industry: Photonics; Electronics
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoplastic / Hot Melt
Aron Alpha Type 212Z, Series 200Z - Ultra Fast Setting, Ethyl -- AA783
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

Aron Alpha 200Z Series. Aron Alpha 200Z Series is engineered for tough-to-bond situations. Ultra fast setting formula excellent for challenging low surface energy substrates. [See More]

  • Industry: Electronics
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Composition: Single Component
Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp New Formula Gray, 5 Gallon, 1 per case -- 2214 [2214 from 3M Industrial Adhesives and Tapes]
from Heilind Electronics, Inc.

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 Hi-Temp New Formula is a gray, rigid, aluminum filled, one-part epoxy adhesive. Cures in 60 minutes at 250 Degrees F/121 Degrees C. Highest temperature resistance. Heat cure. improved performance at lower temperatures. General industrial, sporting... [See More]

  • Industry: Electronics
  • Viscosity: 1.00E6
  • Chemical System: Epoxy
ABLEBOND 8008NC -- 8802604974081
from Henkel Corporation - Electronics

ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology. [See More]

  • Industry: Electronics
  • Thermal Conductivity: 0.5000
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
3M(TM) Light Cure Adhesive LC1110 Colorless, 30 cu cm, 6 per bag -- 021200-43847
from R. S. Hughes Company, Inc.

3M(TM) Light Cure Adhesive LC1110 Colorless, 30 cu cm, 6 per bag. One-component, medium viscosity adhesive that cures rapidly when exposed to UV light to form a semi-rigid bond. Features include: cures with UV light, cures in seconds, cures to tack-free surface, and has low corrosion properties. [See More]

  • Industry: Electronics
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Gel
  • Use: Impregnating Resin
  • Cure / Technology: Non-Drying
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Composition: Single Component
Double/Bubble® Epoxy Adhesive -- 4001 [4001 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Features: Thermally Conductive
Electronic Protective Coating Silicone Compound -- Bluesil™ V-205
from Bluestar Silicones USA Corp.

One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
8793476 [3145 CLR from Dow Corning Analytical Solutions]
from Farnell Europe

SEALANT, SILICONE, CLEAR, 310ML [See More]

  • Industry: Electronics
  • Chemical System: Silicone
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Industry: Electronics
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
H2O Moisture Absorbing Compound -- H2O10CT
from H2O Control Products, Inc.

MAC Industrial Gel 10 oz. Caulking Tube [See More]

  • Industry: Electronics
  • Composition: Single Component
  • Form / Shape: Gel
  • Features: Moisture Absorbing
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic; Dimethacrylate Ester
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Composition: Two Component  
Die Attach Adhesives
from Metalor Technologies USA Corporation

Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]

  • Industry: Electronics
  • Features: Electrically Conductive
HEAT SINK COMPOUND, WHT SYRINGE 1OZ -- 00Z1552 [10-8132 from GC Electronics]
from Newark / element14

HEAT SINK COMPOUND, WHT SYRINGE 1OZ; Sealant Applications:Electronics; Color:White; Dispensing Method:Syringe; Volume:1fl.oz. (US) [See More]

  • Industry: Electronics
Silicon Rubber -- RTV 100-101
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Thermal Grease
from PENCOM

For heat sinks/spreaders in virtually any commercially available material [See More]

  • Industry: Electronics
  • Features: Thermally Conductive
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
KE 441
from Shin-Etsu Silicones of America

Excellent adhesion to many substrates [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing