Sites:
Search Electronics:
 
3M™ High Tack Pressure Sensitive Adhesive 3794 -- 3794
from 3M Industrial Adhesives and Tapes

3M ™ High Tack Pressure Sensitive Adhesive 3794B is a 100% solids thermoplastic, general purpose, high tack, pressure sensitive adhesive that can be spray or bead applied. Sprayable. High tack pressure sensitive adhesive (PSA). 100 percent solids. 3M ™ High Tack Pressure Sensitive... [See More]

  • Industry: Electronics
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Chemical System: Block Co-Polymer
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Composition: Single Component; Unfilled
567™ PST® Thread Sealant -- 56747 [56747 from Henkel Corporation]
from Applied Industrial Technologies

50 mL Tube; Withstands Temperatures to 400 °F w/Excellent Solvent Resistant; Locks and Seals Tapered Pipe Threads and Fittings, Including High Pressure Applications; Disassembles w/Hand Tools [See More]

  • Industry: Photonics; Electronics
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoplastic / Hot Melt
3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
  • Form / Shape: Sheet or Film
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Industry: Semiconductors, IC's; Electronics
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
3M(TM) Light Cure Adhesive LC1110 Colorless, 30 cu cm, 6 per bag -- 021200-43847
from R. S. Hughes Company, Inc.

3M(TM) Light Cure Adhesive LC1110 Colorless, 30 cu cm, 6 per bag. One-component, medium viscosity adhesive that cures rapidly when exposed to UV light to form a semi-rigid bond. Features include: cures with UV light, cures in seconds, cures to tack-free surface, and has low corrosion properties. [See More]

  • Industry: Electronics
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Gel
  • Use: Impregnating Resin
  • Cure / Technology: Non-Drying
Adhesive -- ELASTOSIL® RT 705 F
from Wacker Chemical Corp.

ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Composition: Single Component
3M™ Permanent Label Adhesive -- 100 High-Temp. Acrylic
from 3M Electronics Design & Manufacturing

In most cases, when you send a label into the elements, you hope it will hold up and look good for years to come. Temperature extremes, moisture, and sunlight can all take their toll. Legibility may be critical. Look to 3M for label solutions that last. [See More]

  • Industry: Electronics
  • Composition: Single Component; Unfilled
  • Chemical System: Acrylic
  • Features: UL Rating
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
Firestop Putty Pad -- PuttyPad
from Acoustical Solutions, Inc.

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

  • Industry: Electronics
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Composition: Single Component
Double/Bubble® Epoxy Adhesive -- 4001 [4001 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
CA-020 Instant Adhesive
from Anti-Seize Technology

Most versatile instant adhesive, fast overall cure speed, regular viscosity [See More]

  • Industry: Electronics
  • Chemical System: Cyanoacrylate
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Aremco-Seal -- 613
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Features: Thermally Conductive
Baytec® ENC -- BAYTEC ENC 5003
from Bayer MaterialScience LLC

Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]

  • Industry: Electronics
  • Chemical System: PMDI
  • Form / Shape: Liquid
  • Cure / Technology: Thermoplastic / Hot Melt
Electronic Protective Coating Silicone Compound -- Bluesil™ V-205
from Bluestar Silicones USA Corp.

One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Industry: Electronics
  • Form / Shape: Sheet or Film
  • Use: Die Bonding Adhesives
  • Chemical System: Acrylic
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
8793476 [3145 CLR from Dow Corning Analytical Solutions]
from Farnell Europe

SEALANT, SILICONE, CLEAR, 310ML [See More]

  • Industry: Electronics
  • Chemical System: Silicone
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Industry: Electronics
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
H2O Moisture Absorbing Compound -- H2O10CT
from H2O Control Products, Inc.

MAC Industrial Gel 10 oz. Caulking Tube [See More]

  • Industry: Electronics
  • Composition: Single Component
  • Form / Shape: Gel
  • Features: Moisture Absorbing
Chipbonder® Surface Mount Adhesive -- Cornerbond 3515
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Industry: Electronics
  • Cure / Technology: Thermoset
  • Use: Die Bonding Adhesives
  • Composition: Filled
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic; Dimethacrylate Ester
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Composition: Two Component  
Silicon Rubber -- RTV 100-101
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Thermal Grease
from PENCOM

For heat sinks/spreaders in virtually any commercially available material [See More]

  • Industry: Electronics
  • Features: Thermally Conductive
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Industry: Semiconductors, IC's; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
U691
from Scapa Group plc

U691 [See More]

  • Industry: Electronics
  • Chemical System: Acrylic
KE 441
from Shin-Etsu Silicones of America

Excellent adhesion to many substrates [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing
Sensors, Adhesives and Epoxies -- TC-ADH-989S
from SuperLogics, Inc.

3000 °F high purity, rapid curing alumina adhesive - 4 oz. bottle [See More]

  • Industry: Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Alumina