Optoelectronics / Photonics Electrical and Electronic Resins Datasheets

567™ PST® Thread Sealant -- 56747 [56747 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

50 mL Tube; Withstands Temperatures to 400 °F w/Excellent Solvent Resistant; Locks and Seals Tapered Pipe Threads and Fittings, Including High Pressure Applications; Disassembles w/Hand Tools [See More]

  • Industry: Photonics; Electronics
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoplastic / Hot Melt
Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Cryogenically Serviceable Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Industry: Semiconductors, IC's; Photonics; Electronics; Electric Power
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy; Polyurethane
RTV-2 Silicone Rubber -- ELASTOSIL® Solar 3210 A/B
from Wacker Chemical Corp.

ELASTOSIL ® Solar 3210 A/B is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to yield a crystal clear vulcanisate of medium hardness and with very high transmission. Special features. two-part system, 9:1 mixing ratio. low viscosity. rapid heat cure. [See More]

  • Industry: Photonics
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Double/Bubble® Epoxy Adhesive -- 4004 [4004 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Photonics; Electronics
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Air Setting / Film Drying
Crystalbond™ -- 509
from Aremco Products, Inc.

Odorless, non-flammable, biodegradable water-risible solvent [See More]

  • Industry: Photonics; Electronics
  • Form / Shape: Mounting
  • Use: Die Bonding Adhesives
  • Chemical System: Proprietary
UV Structural Adhesive -- ELC 4480
from Electro-Lite Corporation

Designed for joining fiber optics as well as glass to glass assembly [See More]

  • Industry: Photonics
  • Chemical System: Acrylic; Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
Silver Filled Epoxy Resin -- 40-3900
from Epoxies Etc...

40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature... [See More]

  • Industry: Photonics; Electronics
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Industry: Photonics; Electronics; Electric Power
  • Form / Shape: Grease, Paste
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Optically Clear UV Adhesive -- ANO-90161
from Protavic America, Inc.

Optically Clear UV adhesive for demanding applications. This product will not yellow when exposed to high heat ( > 260C) or delaminate due to humidity. No negative effect when exposed to 85/85. It has a refractive index of 1.52 [See More]

  • Industry: Photonics
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured