from Applied Industrial Technologies
1" x 10'; Withstands Temperatures Between -65 °F to 500 °F; 700 psi Tensile Strength; 400 vpm Dielectric Strength [See More]
- Features: High Dielectric; UV Resistant
- Cure / Technology: Self Fusing
- Form / Shape: Sheet or Film; Wrap
- Industry: Electric Power
from Bluestar Silicones USA Corp.
Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Device Technologies, Inc.
Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It ’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast ™ Edge Trim, Seal-Fast... [See More]
- Features: High Dielectric
- Form / Shape: Powder; Reel to Reel
- Use: Encapsulant or Conformal Coating
- Chemical System: Epoxy; Polyamide (optional feature); Thermoplastic Polyester (PET, PBT, etc.) (optional feature)
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Air Setting / Film Drying
from Ellsworth Adhesives
CONATHANE EN-20 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. Gallon kit. [See More]
- Features: High Dielectric; UL Rating
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Epoxy Technology
General type, insulative conductivity, oven, snap cure method [See More]
- Features: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
- Cure / Technology: Thermoset
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Cure / Technology: Thermoset
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
- Form / Shape: Gel
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Form / Shape: Grease, Paste; Optional Premixed and Frozen
- Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
from Quist Electronics
Provides a mechanical bond, eliminating the need for fasteners or screws [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
- Form / Shape: Sheet or Film
- Use: Die Bonding Adhesives
- Chemical System: Acrylic; Polyamide
from Wacker Chemical Corp.
SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Chemical System: Silicone
from 3M Fire Protection
Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Gap Filler, Foam in Place Gasket
- Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
from Bayer MaterialScience LLC
Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]
- Features: High Dielectric
- Chemical System: PMDI
- Form / Shape: Liquid
- Cure / Technology: Thermoplastic / Hot Melt
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Features: High Dielectric; UL Rating
- Form / Shape: Gel
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Henkel Corporation - Electronics
Withstands polymer decomposition during reflow [See More]
- Features: High Dielectric
- Form / Shape: Gel
- Use: Die Bonding Adhesives
- Chemical System: Silicone
from Novagard Solutions
Non-corrosive, single component silicone coating & encapsulating compound [See More]
- Features: High Dielectric
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Silicone
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Features: High Dielectric; Thermally Conductive
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from SuperLogics, Inc.
2800 °F continuous service fast set alumina adhesive - 4 oz [See More]
- Features: High Dielectric
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Alumina
