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Insulating & Sealing Wrap -- 1212164 [1212164 from Henkel Corporation]
from Applied Industrial Technologies

1" x 10'; Withstands Temperatures Between -65 °F to 500 °F; 700 psi Tensile Strength; 400 vpm Dielectric Strength [See More]

  • Features: High Dielectric; UV Resistant
  • Cure / Technology: Self Fusing
  • Form / Shape: Sheet or Film; Wrap
  • Industry: Electric Power
Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
CONATHANE® EN-20 -- EN-20 GAL KIT
from Ellsworth Adhesives

CONATHANE EN-20 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. Gallon kit. [See More]

  • Features: High Dielectric; UL Rating
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Chemical System: Silicone
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Alkyd Resin, Xylene, M.E.K., Acetone
Epoxy -- 115-1322
from All-Spec Industries

"The CircuitMedic 115-1322 is a high strength, high temperature epoxy kit. " [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric
  • Form / Shape: Grease, Paste
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Baytec® ENC -- BAYTEC ENC 5003
from Bayer MaterialScience LLC

Baytec ENC-5003 is a low-functionality polymeric. diphenylmethane diisocyanate (PMDI) useful in. combination with polyols in the production of cast. urethanes for encapsulation of electrical components. It is also useful in adhesive applications. calling for urethane bonding agents. As with any. [See More]

  • Features: High Dielectric
  • Chemical System: PMDI
  • Form / Shape: Liquid
  • Cure / Technology: Thermoplastic / Hot Melt
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Features: High Dielectric; UL Rating
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Hysol® Die Attach Adhesive -- QMI 282HT
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Features: High Dielectric
  • Form / Shape: Gel
  • Use: Die Bonding Adhesives
  • Chemical System: Silicone
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Features: High Dielectric; Thermal Insulation
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic; Dimethacrylate Ester
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Features: High Dielectric
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Sensors, Adhesives and Epoxies -- TC-ADH-940HT-1
from SuperLogics, Inc.

2800 °F continuous service fast set alumina adhesive - 4 oz [See More]

  • Features: High Dielectric
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Alumina