Electrically Conductive Compound (Adhesive, Grease) Electrical and Electronic Resins Datasheets

Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
ABLESTIK ABLEBOND 958-8C -- 8799556337665
from Henkel Corporation - Electronics

ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. [See More]

  • Features: Electrically Conductive
  • Industry: Electronics
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Form / Shape: Grease, Paste; Optional Premixed and Frozen
  • Use: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
NO-OX-ID "A-Special" Electrical Contact Grease
from Sanchem, Inc.

is the electrical contact grease of choice in new electrical installations and maintenance because of its excellent performance in keeping metals free from corrosion. This rust preventitive has been used for over 50 years to preventing corrosion in electrical connectors from low micro-power... [See More]

  • Features: Electrically Conductive
  • Form / Shape: Gel
  • Use: Impregnating Resin
  • Cure / Technology: Non-Drying
SnapTrace® Heat Transfer Compound -- ST-1
from Thermon Manufacturing Co.

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation on straight piping runs 1-1/2 inches (38 mm) and larger. Thermon ’s heat transfer compounds provide an efficient thermal connection between the tracer and the process equipment. By eliminating... [See More]

  • Features: Electrically Conductive; Non-soluable in water
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Grease, Paste
  • Industry: Electric Power
Electrically Conductive Adhesive -- SEMICOSIL® 979 EC
from Wacker Chemical Corp.

SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]

  • Features: Electrically Conductive
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Epoxy Conductive Adhesive + Hardener -- CW2400 [CW2400 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CW2400 is a two-part conductive epoxy for precision repair and high-strength conductive bonding. [See More]

  • Features: Electrically Conductive
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Form / Shape: Grease, Paste
  • Use: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Features: Electrically Conductive
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
INSULCAST LN 1-05 Epoxy Potting Compound
from ITW Polymer Technologies - Insulcast Division

Crack Resistant Epoxy Potting and Encapsulation Compounds - ITW INSULCAST LN 1-05 is a highly crack resistant epoxy compound specifically designed for large potting and encapsulation applications. It displays excellent electrical properties over a wide range of temperatures. INSULCAST LN 1-05 make... [See More]

  • Features: Electrically Conductive; Flame Retardant; Thermal Insulation; UL Rating
  • Form / Shape: Gel
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Features: Electrically Conductive
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Industry: Electronics
Die Attach Adhesives
from Metalor Technologies USA Corporation

Electrically and thermally conductive adhesives for microelectronic applications. Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading supplier... [See More]

  • Features: Electrically Conductive
  • Industry: Electronics
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Features: Electrically Conductive; Thermal Insulation
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured