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3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Black, 1.7 fl oz, 12 per case -- 62326614351
from 3M Industrial Adhesives & Tapes Canada

3M ™ Scotch-Weld ™ Epoxy Potting Compound DP270 is a rigid, two-part epoxy adhesive potting compound. 1:1 mix ratio, 70 minute work life and handling strength in approximately 3 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator and mix nozzles are required (not... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Electronics
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Form / Shape: Liquid
  • Industry: Electronics
VORATRON® Cable Joints Systems
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Use: Encapsulant, Potting Compound
  • Industry: Electric Power
  • Chemical System: Polyurethane
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Form / Shape: Liquid
  • Industry: Electronics
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Use: Die Bonding Adhesives; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Cure / Technology: Thermoset
Fast Curing, One Component Silicone -- MS711
from Master Bond, Inc.

Master Sil 711 is a ready-to use, exceptionally fast curing, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound is self leveling and can be readily applied to various surfaces. It cures at ambient... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Fluoro Silicone Gel -- SEMICOSIL® 927 F
from Wacker Chemical Corp.

SEMICOSIL ® 927F is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber that cures to a soft silicone gel. Special characteristics. One-part, ready-to-use. Thixotropic behavior. Rapid heat cure. Very low hardness (gel). Outstanding resistance to chemicals. [See More]

  • Use: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Industry: Electronics
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste
  • Cure / Technology: Thermoset
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: UV or Radiation Cured
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Gel
  • Cure / Technology: Air Setting / Film Drying
Circuit Board Protection -- 3900
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Acrylic
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Form / Shape: Gel
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Use: Die Bonding Adhesives; Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset