Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Composition: Single Component; Unfilled
  • Cure / Technology: Thermoset
  • Form / Shape: Grease, Paste
  • Industry: Electronics
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Composition: Two Component  ; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Industry: Electronics
Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Single Component; Unfilled; Solvent Based
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating
  • Cure / Technology: Air Setting / Film Drying
Casting Resin EP1121 400ml Clear -- EP1121 CLEAR 400ML [EP11HT GRAY - B GL from Resinlab]
from Ellsworth Adhesives

Resinlab ™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air [See More]

  • Composition: Two Component  ; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound
  • Chemical System: Epoxy
General -- 730 Unfilled
from Epoxy Technology

A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices. [See More]

  • Composition: Two Component  ; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
Hapflex™ 1000 Series High Performance Hybrid Elastomeric Polymer Alloy -- 1021
from Hapco, Inc.

HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]

  • Composition: Two Component  ; Unfilled
  • Chemical System: Polyurethane
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Composition: Two Component  ; Unfilled
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Epoxy
Fast Curing, Heat Resistant Epoxy System -- S65HT-6
from Master Bond, Inc.

Master Bond Polymer Adhesive Supreme65HT-6 represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of processing strengths. This two component, toughened, heat resistant adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. [See More]

  • Composition: Two Component  ; Unfilled
  • Chemical System: Epoxy
  • Use: Die Bonding Adhesives
  • Industry: Electronics; Electric Power
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Synthetic Based
  • Form / Shape: Grease, Paste
  • Cure / Technology: Air Setting / Film Drying
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset
3M™ Permanent Label Adhesive -- 100 High-Temp. Acrylic
from 3M Electronics Design & Manufacturing

In most cases, when you send a label into the elements, you hope it will hold up and look good for years to come. Temperature extremes, moisture, and sunlight can all take their toll. Legibility may be critical. Look to 3M for label solutions that last. [See More]

  • Composition: Single Component; Unfilled
  • Industry: Electronics
  • Chemical System: Acrylic
  • Features: UL Rating
20419 [20419 from Henkel Corporation]
from All-Spec Industries

Tak Pak instant adhesive 444 for PCB assembly and repair [See More]

  • Composition: Unfilled
  • Cure / Technology: Air Setting / Film Drying
  • Form / Shape: Liquid
  • Industry: Electronics
Aremco-Bond™ Epoxy -- 2300
from Aremco Products, Inc.

Milky clear, low viscosity, exceptional bond strength [See More]

  • Composition: Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Composition: Unfilled
  • Form / Shape: Sheet or Film
  • Use: Die Bonding Adhesives
  • Chemical System: Acrylic
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Composition: Two Component  ; Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Composition: Two Component  ; Unfilled
  • Form / Shape: Gel
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
Circuit Board Protection -- US5500
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
  • Chemical System: Polyurethane
Cylinlock® -- 822
from Hernon Manufacturing, Inc.

Cylinlock ® Retaining Compounds are highly engineered, 100% active, high strength anaerobic liquids that cure to a. tough plastic when air is excluded. The plastic shim formed when Cylinlock ® cures fills the voids present in even the. best shrink or press fits. These compounds also find... [See More]

  • Composition: Single Component; Unfilled
  • Form / Shape: Liquid
  • Use: Gap Filler, Foam in Place Gasket
  • Chemical System: Acrylic; Dimethacrylate Ester
Silicon Rubber -- RTV 100-101
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Composition: Single Component; Unfilled
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
  • Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Composition: Two Component  ; Unfilled
  • Form / Shape: Liquid
  • Use: Die Bonding Adhesives
  • Cure / Technology: Thermoset; UV or Radiation Cured
Sensors, Adhesives and Epoxies -- TC-ADH-940HT-1
from SuperLogics, Inc.

2800 °F continuous service fast set alumina adhesive - 4 oz [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Use: Die Bonding Adhesives
  • Chemical System: Alumina