from Applied Industrial Technologies
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Industry: Electronics
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Composition: Single Component; Unfilled; Solvent Based
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating
- Cure / Technology: Air Setting / Film Drying
from Ellsworth Adhesives
Resinlab ™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant, Potting Compound
- Chemical System: Epoxy
from Epoxy Technology
A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices. [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Polyurethane
- Form / Shape: Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from ITW Polymer Technologies - Insulcast Division
INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond Polymer Adhesive Supreme65HT-6 represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of processing strengths. This two component, toughened, heat resistant adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. [See More]
- Composition: Two Component ; Unfilled
- Chemical System: Epoxy
- Use: Die Bonding Adhesives
- Industry: Electronics; Electric Power
from Quist Electronics
Ultra-conforming, designed for fragile and low-stress applications [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Composition: Single Component; Unfilled
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Thermoset
from 3M Electronics Markets Materials Division
In most cases, when you send a label into the elements, you hope it will hold up and look good for years to come. Temperature extremes, moisture, and sunlight can all take their toll. Legibility may be critical. Look to 3M for label solutions that last. [See More]
- Composition: Single Component; Unfilled
- Industry: Electronics
- Chemical System: Acrylic
- Features: UL Rating
from Dielectric Polymers, Inc.
Mounting nameplates, signs, graphic panels, and decorative trim [See More]
- Composition: Unfilled
- Form / Shape: Sheet or Film
- Use: Die Bonding Adhesives
- Chemical System: Acrylic
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Gel
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Composition: Single Component; Unfilled
- Form / Shape: Liquid
- Use: Encapsulant or Conformal Coating; Encapsulant, Potting Compound
- Chemical System: Polyurethane
from Novagard Solutions
Single component, moisture cured silicone rubber, strong durable sealant [See More]
- Composition: Single Component; Unfilled
- Chemical System: Silicone
- Form / Shape: Grease, Paste
- Cure / Technology: Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing; Thermoset
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Composition: Two Component ; Unfilled
- Form / Shape: Liquid
- Use: Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured
from SuperLogics, Inc.
2800 °F continuous service fast set alumina adhesive - 4 oz [See More]
- Composition: Unfilled
- Form / Shape: Grease, Paste
- Use: Die Bonding Adhesives
- Chemical System: Alumina
