Non-corrosive Cure Laminating Adhesives and Composite Resins Datasheets

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
Cryogenically Serviceable Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; Sealant
  • Chemical System: Epoxy; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
AFFINITY GA Polyolefin Plastomers -- AFFINITY™ GA 1900
from Dow Elastomers

When it comes to packaging and molded products, customers demand high performance goods, while you need cost effective and easy to process components. AFFINITY ™ Polyolefin Plastomers can help you address this need. AFFINITY offers excellent adhesion at high and low temperatures, outstanding... [See More]

  • Features: Flexible; Non-corrosive
  • Chemical System: Elastomeric
  • Substrate Compatibility: Composites; Rubber or Elastomer
  • Type / Form: Pellets
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel