Metal Laminating Adhesives and Composite Resins Datasheets

Fluon® Perfluoro Adhesive -- EA-2000
from AGC Chemicals Americas, Inc.

Fluon ® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Glass Cloth, Polyimide, Various Metals
  • Industry: Electronics; PBCs, Heat-resistant Insulating Tape, Heat-resistant Laminated Tubing, Interposers, Steel Plate Laminates
  • Type / Form: Pellets
  • Tensile (Break): 5221
Two-Component Epoxy 50ML -- 90-001896
from Ellsworth Adhesives

OXY-BOND 109-DP is a transparent, two-part, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required. 50ML MixPac. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Optical Fibers
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
3M™ Hi-Strength 90 Spray Adhesive
from 3M Fire Protection

Fast contact strength buildup for many decorative laminates [See More]

  • Substrate Compatibility: Composites; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Cure / Technology: Air Setting / Film Drying; Single Component
Carton Adhesive -- 876
from Aervoe Industries Incorporated

Strong, flexible, waterproof, permanent/temporary bonds, won't bleed, stain [See More]

  • Substrate Compatibility: Metal; Plastic; Porous Surfaces; Carpet, Wallpaper, Upholstery, Leather
  • Industry: Aerospace; Automotive; Asbestos Abatement
  • Cure / Technology: Air Setting / Film Drying; Single Component
  • Use Temperature: 50 to 90
Double Liner Tape -- NT-101W76PLE
from Dielectric Polymers, Inc.

Mounting nameplates, signs, graphic panels, and decorative trim [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Sheet or Film
  • Chemical System: Acrylic
  • Composition: Unfilled
AMPLIFY TY Functional Polymer -- AMPLIFY™ TY 1052H
from Dow Elastomers

These polymers are specially formulated as packaging tie layers, providing excellent adhesion to a variety of substrates, and enable the combination of performance properties necessary for demanding food and other specialty packaging applications. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Rubber or Elastomer
  • Type / Form: Pellets
  • Chemical System: Elastomeric
  • Composition: Unfilled
One component moisture cure urethane -- 10-2000
from Epoxies Etc...

10-2000 is a one component, moisture curing polyurethane adhesive designed for bonding. and laminating. It may also be used to impregnate glass cloth and create a pipe repair. system. FEATURES: • Solvent Free. • No Mixing Required. • Resists Moisture, Solvents and Heat. • High... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Chemical System: Polyurethane
  • Industry: OEM or Industrial
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Unfilled
HCC Concentrate
from Westech Aerosol Corporation

WT-HCC canister is based on the Westech's popular HSC-13 adhesive. It is supplied in a pressurized canister without hydrocarbon propellants so that it can be used with standard pneumatic spray equipment. This permits more flexibility in spray patterns from narrow to broad, fine to coarse pattern as... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Composition: Unfilled

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