Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
Two-Component Epoxy 50ML -- 90-001896
from Ellsworth Adhesives

OXY-BOND 109-DP is a transparent, two-part, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required. 50ML MixPac. [See More]

  • Features: High Dielectric
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Optical Fibers
  • Type / Form: Liquid
Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.

Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Cure / Technology: UV or Radiation Cured; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel