Thermal / Heat Insulating Laminating Adhesives and Composite Resins Datasheets

Dimensionally Stable, One Component UV Curable Adhesive -- UV10TK
from Master Bond, Inc.

Master Bond Polymer UV10TK40 is a unique single component, ultra violet curing, ultra violet stable, modified epoxy resin. This product offer the good adhesion, low shrinkage, and good chemical and water resin resistance associated with epoxy systems in general. UV10TK40 cures tack free in the... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Sealant; Thermal Insulation
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid