Flame Retardant (e.g. UL 94 Rated) Leveling and Filling Compounds Datasheets

Fixmaster® Fast Cure Poxy Pak™ -- 81120 [81120 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

Bonds virtually any material to repair, fill, and seal holes, cracks, etc.. [See More]

  • Features: Adhesive; Flame Retardant
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Features: Adhesive; High Dielectric; Flame Retardant; Non-corrosive; Sealant; UL Rating
  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Type / Form: Liquid
ArmorSeal® 5020 Resurfacer
from Sherwin-Williams Protective & Marine Coatings

ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]

  • Features: Flame Retardant; Sealant
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ High Temperature Void Filler -- EC-3439 HS AF
from 3M Aerospace and Aircraft Maintenance Division

Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a). [See More]

  • Features: Adhesive; Flame Retardant; Sealant
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Substrate Compatibility: Honeycomb Core