Gap Pad VO Soft® [Gap Pad VO Soft® from Bergquist Company (The)]
from Quist Electronics

Enhanced puncture, shear and tear resistance, electrically isolating [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Cure / Technology: Thermoset
  • Composition: Filled
  • Features: Flexible; Electrically Conductive; Flame Retardant
ENGAGE Polyolefin Elastomer -- ENGAGE™ 8003
from Dow Elastomers

When you need a modifier that will help to make your product tough and resilient while flexible at the same time, ENGAGE ™ Polyolefin Elastomers are the answer. ENGAGE ™ provides exceptional performance with an unmatched balance of properties. As one of the first polymers to use INSITE... [See More]

  • Substrate Compatibility: Composites; Rubber or Elastomer
  • Composition: Unfilled
  • Chemical System: Elastomeric
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
Shaft and Bearing -- 53000
from ND Industries, Inc.

Increases shear strength on cylindrical metal assemblies, fills voids [See More]

  • Substrate Compatibility: Composites; Metal; Plastic
  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Type / Form: Liquid