Substrate / Material Compatibility:Other Leveling and Filling Compounds Datasheets

Key Slurry Patch Kit
from Key Resin Company

KEY PATCH KITS are user-friendly pre-packaged kits consisting of resin, hardener and aggregates. Key Patch kits are available as a mortar (for 1/4 inch deep fill or greater) or as a Slurry (for less than 1/4 inch fill). These patch kits are a very economical way to repair a damaged floor or bring... [See More]

  • Substrate Compatibility: Slurry
  • Industry: OEM or Industrial
  • Features: Sealant
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites; Metal; Paper or Paperboard (optional feature); Plastic; Porous Surfaces; Rubber or Elastomer; Textiles or Fabrics (optional feature); Wood (optional feature); Dissimilar Substrates
  • Composition: Unfilled; Filled (optional feature)
  • Chemical System: Phenolic (optional feature); Elastomeric (optional feature); Polyurethane (optional feature); Vinyl (optional feature); Polyphenylene Sulfide (optional feature); Polypropylene (optional feature); Ceramic (optional feature); Acrylic (optional feature); Epoxy (optional feature); Alkyd (optional feature)
  • Cure / Technology: Thermoplastic / Hot Melt (optional feature); Thermoset; Two Component   (optional feature); Single Component; Room Temperature Vulcanizing or Curing (optional feature)
Mineral-based Inorganic Powder -- PC® 85 Powder
from Pittsburgh Corning (FOAMGLAS® insulation)

A mineral-based inorganic powder that has been formulated for filling open surface cells of cellular glass when used in liquid oxygen, liquid nitrogen, and hot tank base insulation. It is used with appropriate interleaving materials to achieve the desired weight load distribution under EN 826 or... [See More]

  • Substrate Compatibility: FOAMGLAS®
  • Features: Adhesive; Sealant
  • Type / Form: Powder
  • Industry: Insulation Systems
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Substrate Compatibility: Honeycomb Core
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Features: Adhesive; Sealant