Substrate / Material Compatibility:Other Leveling and Filling Compounds Datasheets

Acrylic Polymer Based, Pressure Sensitive Hot Melt -- MB528
from Master Bond, Inc.

Master Bond Polymer System MB528 is a high performance 100% solid acrylic resin based hot melt compound designed for use as a hot melt pressure sensitive adhesive. It exhibits good adhesion to a wide variety of materials including polyester, glass, aluminum, steel, fabric and paper. Master Bond... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane; Epoxy
  • Type / Form: Liquid
Mineral-based Inorganic Powder -- PC® 85
from Pittsburgh Corning (FOAMGLAS® insulation)

A mineral-based inorganic powder that has been formulated for filling open surface cells of cellular glass when used in liquid oxygen, liquid nitrogen, and hot tank base insulation. It is used with appropriate interleaving materials to achieve the desired weight load distribution under EN 826 or... [See More]

  • Substrate Compatibility: FOAMGLAS®
  • Features: Adhesive; Sealant
  • Type / Form: Powder
  • Industry: Insulation Systems
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Substrate Compatibility: Honeycomb Core
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Features: Adhesive; Sealant