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Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: Thermally Conductive
  • Form / Shape: Liquid
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: Electrically Conductive
  • Cure / Technology: Two Component  
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Form / Shape: Liquid
CoroBond™ Conductive Vinyl Ester Primer
from Sherwin-Williams Protective & Marine Coatings

CoroBond ™ CONDUCTIVE VINYL ESTER PRIMER is a conductive, elastomer modified epoxy vinyl ester. It is designed to provide superior adhesion to concrete and metal substrates, and resist mechanical stresses such as impact, abrasion, tensile and flexural stress. Excellent chemical resistance. [See More]

  • Chemical System: Elastomer-Modified Epoxy; Epoxy; Alkyd; Vinyl
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Single Component
3M™ Thermally Conductive Adhesive -- TC-2707
from 3M Electronics Markets Materials Division

3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
Similar parts from 3M Electronics Markets Materials Division
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Electrically Conductive
  • Form / Shape: Die Bonding Adhesives
Similar parts from Materion Corporation